公开(公告)号：US20200234995A1

公开(公告)日：2020-07-23

申请号：US16738798

申请日：2020-01-09

申请人： Jagan Rangarajan ,  Edward Golubovsky ,  Shaun Van Der Veen ,  Justin Ho Kuen Wong ,  Steven M. Zuniga

发明人： Jagan Rangarajan ,  Edward Golubovsky ,  Shaun Van Der Veen ,  Justin Ho Kuen Wong ,  Steven M. Zuniga

IPC分类号： H01L21/687 ,  B24B41/06 ,  H01L21/677

摘要： A wafer processing device may include a wafer exchanger including two or more blades, each of the two or more blades may be configured to receive a wafer, the two or more blades may be rotatable about an axis on a single horizontal plane, and the two or more blades may be movable between at least a load cup and a robot access location; wherein the load cup may include a wafer station that is vertically moveable relative a blade located in the load cup and may be configured to remove a wafer from a blade located in the load cup and place a wafer on a blade located in the load cup. Other devices, load cups and methods are also disclosed herein.