发明申请
US20200310105A1 WAFER
审中-公开
- 专利标题: WAFER
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申请号: US16765547申请日: 2018-11-09
-
公开(公告)号: US20200310105A1公开(公告)日: 2020-10-01
- 发明人: Toshimitsu KAWAI , Katsumi SHIBAYAMA , Takashi KASAHARA , Masaki HIROSE , Hiroki OYAMA , Yumi KURAMOTO
- 申请人: HAMAMATSU PHOTONICS K.K.
- 申请人地址: JP Hamamatsu-shi, Shizuoka
- 专利权人: HAMAMATSU PHOTONICS K.K.
- 当前专利权人: HAMAMATSU PHOTONICS K.K.
- 当前专利权人地址: JP Hamamatsu-shi, Shizuoka
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@65a98763
- 国际申请: PCT/JP2018/041732 WO 20181109
- 主分类号: G02B26/00
- IPC分类号: G02B26/00
摘要:
A wafer includes a substrate layer, a first mirror layer having a plurality of two-dimensionally arranged first mirror portions, and a second mirror layer having a plurality of two-dimensionally arranged second mirror portions. A plurality of Fabry-Perot interference filter portions are formed in an effective area, in each of the plurality of Fabry-Perot interference filter portions a gap is formed between the first mirror portion and the second mirror portion. A plurality of dummy filter portions are formed in a dummy area disposed along an outer edge of the substrate layer and surrounding the effective area, in each of the plurality of dummy filter portions an intermediate layer is provided between the first mirror portion and the second mirror portion. At least the second mirror portion is surrounded by the first groove in each of the plurality of Fabry-Perot interference filter portions and the plurality of dummy filter portions.
公开/授权文献
- US11448869B2 Wafer 公开/授权日:2022-09-20
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