Invention Application
- Patent Title: DEVICE-EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME
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Application No.: US16812671Application Date: 2020-03-09
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Publication No.: US20200315034A1Publication Date: 2020-10-01
- Inventor: Takaaki MORITA , Seiichi TAJIMA , Takashi KARIYA
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@27cc31de
- Main IPC: H05K3/46
- IPC: H05K3/46 ; H05K1/18 ; H05K1/11 ; H05K1/03 ; H05K3/10
Abstract:
A device-embedded board includes a board main body, conductor wiring layers formed inside or on a surface of the board main body, and device formation layers formed inside the board main body so as to be in contact with a portion of the conductor wiring layers. The device formation layer is configured in an insulating region in which functional filler for forming a devices is dispersed.
Public/Granted literature
- US11412621B2 Device-embedded board and method of manufacturing the same Public/Granted day:2022-08-09
Information query
