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    ELECTRIC COMPONENT EMBEDDED STRUCTURE
    1.
    发明申请
    ELECTRIC COMPONENT EMBEDDED STRUCTURE 有权

    公开(公告)号：US20210057296A1

    公开(公告)日：2021-02-25

    申请号：US16754395

    申请日：2018-10-25

    Applicant: TDK CORPORATION

    Inventor： Takaaki MORITA ,  Kenichi YOSHIDA ,  Mitsuhiro TOMIKAWA

    IPC: H01L23/12 ,  H01L23/498 ,  H01L23/00

    Abstract: In an electric component embedded structure, a first electrode terminal provided on a first main surface includes an intra-area terminal, and the intra-area terminal is electrically connected to an overlap portion of an overlap wiring in a formation area of an electric component. Accordingly, a decrease in mounting area of the electric component embedded structure is achieved. The intra-area terminal can be electrically connected to a second electrode terminal provided on a second main surface via a first via-conductor, the overlap wiring, and a second via-conductor. The intra-area terminal is connected to a wiring (an overlap wiring) of a first insulating layer without additionally providing a rewiring layer causing an increase in thickness, and the increase in thickness is curbed, whereby a decrease in size of the electric component embedded structure is achieved.

    SOLID ELECTROLYTIC CAPACITOR
    3.
    发明公开
    SOLID ELECTROLYTIC CAPACITOR 审中-公开

    公开(公告)号：US20240161984A1

    公开(公告)日：2024-05-16

    申请号：US18485497

    申请日：2023-10-12

    Applicant: TDK CORPORATION

    Inventor： Akira EBISAWA ,  Hideyuki KOBAYASHI ,  Takaaki MORITA

    IPC: H01G9/028 ,  H01G9/012

    CPC classification number: H01G9/028 ,  H01G9/012 ,  H01G2009/05

    Abstract: A solid electrolytic capacitor includes: a valve metal support having an anode terminal region and a cathode forming region and forming an anode part; and a cathode part provided in a cathode forming region of the valve metal support. The cathode part includes: a solid electrolyte layer that is disposed on a surface of a dielectric layer provided at least on the cathode forming region of the valve metal support and contains a conductive polymer; a waterproof seed layer that is disposed on a surface of the solid electrolyte layer and contains a conductive material; and a metal plating layer disposed on a surface of the waterproof seed layer. A catalytic metal having catalytic activity for plating is provided on the surface of the waterproof seed layer.

    SOLID ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURING SOLID ELECTROLYTIC CAPACITOR
    4.
    发明公开
    SOLID ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURING SOLID ELECTROLYTIC CAPACITOR 审中-公开

    公开(公告)号：US20240355554A1

    公开(公告)日：2024-10-24

    申请号：US18639569

    申请日：2024-04-18

    Applicant: TDK Corporation

    Inventor： Takaaki MORITA ,  Hideyuki KOBAYASHI ,  Yusuke TAKAHASHI ,  Masaki OIKAWA ,  Tetsushi INOUE

    IPC: H01G9/15 ,  H01G9/07

    CPC classification number: H01G9/15 ,  H01G9/07

    Abstract: A solid electrolytic capacitor according to one embodiment of the present disclosure may include a stacked body having a plurality of stacked solid electrolytic capacitor elements being stacked, a first side electrode arranged on a first side surface of the stacked body, and a second side electrode arranged on a second side surface of the stacked body. Each of the solid electrolytic capacitor elements may include an anode electrode layer, a dielectric layer, a cathode electrode layer, a solid electrolyte layer, and an insulating region arranged on the anode electrode layer and adjacent to a side of the solid electrolyte layer. The first distance between the anode electrode layer and the second side electrode may be smaller than the second distance between the insulating region and the second side electrode.

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