Invention Application
- Patent Title: HETERODIMERIC ANTIBODIES THAT BIND ENPP3 AND CD3
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Application No.: US16805453Application Date: 2020-02-28
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Publication No.: US20200317814A1Publication Date: 2020-10-08
- Inventor: Rumana Rashid , Umesh S. Muchhal , Gregory Moore , Alex Nisthal , Seung Chu , Sung-Hyung Lee , Yoon Kyung Kim
- Applicant: Xencor, Inc.
- Main IPC: C07K16/40
- IPC: C07K16/40 ; C07K16/46 ; C07K16/28 ; C12N15/63
Abstract:
The present invention is directed to antibodies, including novel antigen binding domains and heterodimeric antibodies, that bind Ectonucleotide pyrophosphatase/phosphodiesterase family member 3 (ENPP3).
Public/Granted literature
- US11472890B2 Heterodimeric antibodies that bind ENPP3 and CD3 Public/Granted day:2022-10-18
Information query
