- 专利标题: ROUTING FOR POWER SIGNALS INCLUDING A REDISTRIBUTION LAYER
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申请号: US16909677申请日: 2020-06-23
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公开(公告)号: US20200321034A1公开(公告)日: 2020-10-08
- 发明人: Takayori Hamada , Yasuhiko Tanuma
- 申请人: Micron Technology, Inc.
- 主分类号: G11C5/06
- IPC分类号: G11C5/06 ; G11C7/10 ; H01L23/522
摘要:
Semiconductor devices and systems are disclosed. A semiconductor device includes a redistribution layer including a first polygonal structure for conveying a first power signal and including a first cutout region. The semiconductor device further includes a second polygonal structure for conveying a second power signal. Further, the semiconductor device includes an island polygon for conveying a third power signal and positioned within the first cutout region, wherein the island polygon does not touch the first polygonal structure.
公开/授权文献
- US11176970B2 Routing for power signals including a redistribution layer 公开/授权日:2021-11-16
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