发明申请
- 专利标题： Semiconductor Device
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申请号： US16838189申请日： 2020-04-02
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公开(公告)号： US20200321463A1公开(公告)日： 2020-10-08
- 发明人: Joachim Weyers , Andreas Boehm , Franz Hirler , Enrique Vecino Vazquez
- 申请人： Infineon Technologies Dresden GmbH & Co. KG
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4443f410
- 主分类号： H01L29/78
- IPC分类号： H01L29/78 ; H01L29/06 ; H01L29/40 ; H01L29/423 ; H01L29/08 ; H01L29/66 ; H01L29/49 ; H01L29/10
摘要：
A semiconductor device includes a semiconductor body comprising a first surface, a second surface opposite to the first surface, an active region, and an edge region surrounding the active region in a horizontal plane. The semiconductor device further includes a plurality of transistor cells at least partly integrated in the active region. Each transistor cell includes a drift region separated from a source region by a body region, and a gate electrode dielectrically insulated from the body region. The semiconductor device also includes a sensor device having a first sensor region of a first doping type integrated in the edge region. The first sensor region is electrically coupled to a first contact pad and to a second contact pad. Each contact pad is arranged either on the first surface or on the second surface. The sensor device at least partially extends around the active region.
公开/授权文献
- US11424358B2 Semiconductor device with sensor for crack detection 公开/授权日：2022-08-23
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