Invention Application
- Patent Title: ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
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Application No.: US16711286Application Date: 2019-12-11
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Publication No.: US20210013409A1Publication Date: 2021-01-14
- Inventor: Woo Tae LEE , Beom Seok LEE
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon
- Priority: KR10-2019-0084761 20190712
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/22 ; H01L27/24 ; H01L43/02 ; H01L43/12
Abstract:
A method of manufacturing an electronic device including a semiconductor memory may include forming a first active layer, forming a first electrode material over the first active layer, performing a heat treatment process on the first electrode material and the first active layer, and forming a second electrode material over the heat-treated first electrode material.
Public/Granted literature
- US11183634B2 Electronic device and method of manufacturing electronic device Public/Granted day:2021-11-23
Information query
IPC分类:
