Invention Application
- Patent Title: APPARATUS WITH HOUSING HAVING STRUCTURE FOR RADIATING HEAT
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Application No.: US16923452Application Date: 2020-07-08
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Publication No.: US20210015005A1Publication Date: 2021-01-14
- Inventor: Sangsoo YU , Sehoon KIM , Jeongmin PARK
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Priority: KR10-2019-0084262 20190712,KR10-2020-0054411 20200507
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K5/03 ; H05K5/02

Abstract:
The disclosure relates to an apparatus with a housing having a structure for heat dissipation, the apparatus including the housing having at least one surface, outer walls, and a plurality of fins, and an operating unit fixed to the housing, wherein the at least one surface of the housing includes a fin cover connected to the fins, a base exposed in an internal space in which the operating unit is disposed, and a refrigerant filled in a space between the fin cover and the base, wherein the fin cover and the base are connected through the outer walls, and wherein the fin cover has a flat surface.
Public/Granted literature
- US11839057B2 Apparatus with housing having structure for radiating heat Public/Granted day:2023-12-05
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