公开(公告)号：US20210015005A1

公开(公告)日：2021-01-14

申请号：US16923452

申请日：2020-07-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangsoo YU ,  Sehoon KIM ,  Jeongmin PARK

IPC: H05K7/20 ,  H05K5/03 ,  H05K5/02

Abstract: The disclosure relates to an apparatus with a housing having a structure for heat dissipation, the apparatus including the housing having at least one surface, outer walls, and a plurality of fins, and an operating unit fixed to the housing, wherein the at least one surface of the housing includes a fin cover connected to the fins, a base exposed in an internal space in which the operating unit is disposed, and a refrigerant filled in a space between the fin cover and the base, wherein the fin cover and the base are connected through the outer walls, and wherein the fin cover has a flat surface.

公开(公告)号：US20190069426A1

公开(公告)日：2019-02-28

申请号：US15978914

申请日：2018-05-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangsoo YU ,  Heewoo LEE ,  Hyunsuk Jang ,  Raehong Cho

IPC: H05K5/04 ,  H01R13/52 ,  H01R13/6581 ,  H01R13/512 ,  H05K5/00 ,  H05K5/02 ,  H05K7/20

Abstract: A communication device enclosure is made of different materials. The communication device enclosure includes a first housing, a second housing, and a connector cover. The first housing is formed in a box shape and has one open face and one open lateral face adjacent to the one open face. The second housing is formed in a box shape and has one open face and one open lateral face adjacent to the one open face. The first and second housings form together an inner space for containing an electronic component. The connector cover is formed of a material different from materials of the first and second housings, is disposed on the open lateral faces of the first and second housings, and has a connector for electric connection between the electronic component and an external device. The connector cover is combined with the first and second housings to seal the inner space.