- 专利标题: PLATE TYPE HEAT EXCHANGER
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申请号: US16927028申请日: 2020-07-13
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公开(公告)号: US20210033349A1公开(公告)日: 2021-02-04
- 发明人: Jiwon Choi , Eungyul Lee , Hanchoon Lee
- 申请人: LG ELECTRONICS INC.
- 申请人地址: KR Seoul
- 专利权人: LG ELECTRONICS INC.
- 当前专利权人: LG ELECTRONICS INC.
- 当前专利权人地址: KR Seoul
- 优先权: KR10-2019-0091522 20190729
- 主分类号: F28D9/00
- IPC分类号: F28D9/00 ; F28F3/04
摘要:
A plate type heat exchanger according to an embodiment of the present disclosure includes a plate package in which a plurality of heat exchange plates is stacked to form a flow path, through which fluid flows, an end plate coupled to an outside of the plate package, and a socket connected to the plate package by passing through the end plate, in which the end plate includes a base which is in contact with the outside of the plate package, a socket hole which is formed through the base and into which the socket is inserted, and a ridge which protrudes outward from an edge of the socket hole of the base.
公开/授权文献
- US11353268B2 Plate type heat exchanger 公开/授权日:2022-06-07
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