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公开(公告)号：US20240280327A1
公开(公告)日：2024-08-22
申请号：US18581927
申请日：2024-02-20
申请人： LG ELECTRONICS INC.
发明人： Sungwoo Kim , Hongseong Kim , Seungmo Jung , Hanchoon Lee
IPC分类号： F28D9/00
CPC分类号： F28D9/0075
摘要： A heat exchanger includes a plurality of fins each having an opening formed in an upper portion thereof and an opening formed in a lower portion thereof to allow a refrigerant to flow and being provided therein with a flow path through which the refrigerant flows, the plurality of fins being arranged at intervals in one direction; and a header formed at each of the upper portions and lower portions of the plurality of fins, the header being in communication with the flow path. At least one fin, among the plurality of fins, is configured such that at least one of the opening in the upper portion and the opening in the lower portion is closed.
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公开(公告)号：US20210033349A1
公开(公告)日：2021-02-04
申请号：US16927028
申请日：2020-07-13
申请人： LG ELECTRONICS INC.
发明人： Jiwon Choi , Eungyul Lee , Hanchoon Lee
摘要： A plate type heat exchanger according to an embodiment of the present disclosure includes a plate package in which a plurality of heat exchange plates is stacked to form a flow path, through which fluid flows, an end plate coupled to an outside of the plate package, and a socket connected to the plate package by passing through the end plate, in which the end plate includes a base which is in contact with the outside of the plate package, a socket hole which is formed through the base and into which the socket is inserted, and a ridge which protrudes outward from an edge of the socket hole of the base.
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公开(公告)号：US10077926B2
公开(公告)日：2018-09-18
申请号：US15150804
申请日：2016-05-10
申请人： LG ELECTRONICS INC.
发明人： Hongseong Kim , Sangyeul Lee , Inbeom Cheon , Hanchoon Lee , Juhyok Kim
CPC分类号： F25B41/06 , F25B13/00 , F25B39/028 , F28D2021/0071 , F28F9/026 , F28F9/0265 , F28F2250/00
摘要： An air conditioner and evaporator inlet header distributor therefor are provided. The air conditioner may include an evaporator inlet header distributor to distribute a refrigerant expanded in an expansion mechanism to a plurality of refrigerant flow paths of an evaporator. The evaporator inlet header distributor may include a distributor body, a refrigerant inlet pipe to guide refrigerant expanded in the expansion mechanism to an inside of the distributor body, a plurality of refrigerant outlet pipes to discharge the refrigerant from the distributor body into the plurality of refrigerant flow paths, and a separating plate to separate the inside of the distributor body into a header flow path connected with the plurality of refrigerant outlet pipes and a refrigerant dispersing flow path connected with the refrigerant inlet pipe to guide an upper portion and a lower portion of the header flow path by dispersing the refrigerant. Accordingly, two-phase refrigerant may be uniformly distributed to the plurality of refrigerant outlet pipes using a simple structure.
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公开(公告)号：US12130092B2
公开(公告)日：2024-10-29
申请号：US17425009
申请日：2020-01-28
申请人： LG ELECTRONICS INC.
发明人： Jiwon Choi , Hongseong Kim , Yohan Lee , Hanchoon Lee
CPC分类号： F28F1/40 , F28D7/16 , F28F13/12 , F28D2021/0071
摘要： A heat transfer pipe includes an outer pipe having a space therein and extending a first direction, a core disposed in the space inside the outer pipe, defining a refrigerant flow space through which a refrigerant flows between an inner surface of the outer pipe and the core, and extending in the first direction, and a resistor disposed in the refrigerant flow space and having a spiral shape with a central axis disposed to be parallel to the first direction.
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公开(公告)号：US11353268B2
公开(公告)日：2022-06-07
申请号：US16927028
申请日：2020-07-13
申请人： LG ELECTRONICS INC.
发明人： Jiwon Choi , Eungyul Lee , Hanchoon Lee
摘要： A plate type heat exchanger includes a plate package in which a plurality of heat exchange plates is stacked to form a flow path, through which fluid flows, an end plate coupled to an outside of the plate package, and a socket connected to the plate package by passing through the end plate. The end plate includes a base which is in contact with the outside of the plate package, a socket hole which is formed through the base and into which the socket is inserted, and a ridge that protrudes outward from an edge of the socket hole of the base.
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公开(公告)号：US20220120501A1
公开(公告)日：2022-04-21
申请号：US17501256
申请日：2021-10-14
申请人： LG ELECTRONICS INC.
发明人： Sungwoo KIM , Hongseong Kim , Seungmo Jung , Hanchoon Lee
摘要： The present disclosure relates to a heat exchanger. The heat exchanger includes: a plurality of tube panels including a tube elongated in one direction; a pair of header modules coupled to both ends of the plurality of tube panels; and a pair of header cases having an open side, providing a space therein, and having the header module inserted in the space such that the tube panels communicate with the spaces, in which the header modules is composed of a plurality of header blocks stacked and coupled to each other, and an insertion hole in which the tube panel is inserted is formed at each of the plurality of header blocks. Accordingly, it is possible to increase the efficiency of manufacturing a heat exchanger, manufacture a heat exchanger flexibly in a custom-made type in accordance with the size of a product having the heat exchanger, reduce tolerance due to brazing, and improve stability of a product.
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公开(公告)号：US09566672B2
公开(公告)日：2017-02-14
申请号：US14096203
申请日：2013-12-04
申请人： LG ELECTRONICS INC.
发明人： Juhyok Kim , Hongseong Kim , Hanchoon Lee , Sangyeul Lee
CPC分类号： B23P15/26 , B21D19/088 , B21D53/022 , B21D53/08 , B21D53/085 , B23K1/0012 , B23K2101/14 , B23K2103/10 , F28F1/30 , F28F2275/04 , F28F2275/125 , Y10T29/49373 , Y10T29/49375 , Y10T29/49378
摘要： A heat exchanger and a method of manufacturing the same are provided. With the method, a tube may be inserted into a through hole formed in at least one fin coated with a filler metal, and the tube and a fin collar of the at least one fin may be joined through the filler metal by a brazing processing. A flange may not be formed on or at a top of the at least one fin collar, which protrudes vertically from a central longitudinal plane of the at least one fin. The tube may be made of aluminum (Al), and an interval between an outer circumferential surface of the tube and an inner circumferential surface of the fin collar of the at least one fin may be approximately 0.1 mm or less. Accordingly, contact resistance occurring when fabricating a fin-tube heat exchanger using a mechanical tube expansion method may be reduced, and heat transfer performance of the heat exchanger may be improved because grooves formed within the tube may not be deformed.
摘要翻译： 提供一种热交换器及其制造方法。 利用该方法，管可以插入到形成在涂覆有填充金属的至少一个翅片中的通孔中，并且该管和至少一个翅片的翅片套环可以通过钎焊处理通过填充金属接合。 凸缘可以不形成在从至少一个翅片的中心纵向平面垂直突出的至少一个翅片环的顶部或顶部。 管可以由铝（Al）制成，并且管的外周表面与至少一个翅片的翅片套环的内圆周表面之间的间隔可以为大约0.1mm或更小。 因此，可以减少使用机械管膨胀法制造翅片管式热交换器时发生的接触电阻，并且可以改善热交换器的传热性能，因为形成在管内的槽可能不会变形。
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公开(公告)号：US09605908B2
公开(公告)日：2017-03-28
申请号：US13955833
申请日：2013-07-31
申请人： LG Electronics Inc.
发明人： Juhyok Kim , Hongseong Kim , Hanchoon Lee , Sangyeul Lee
CPC分类号： F28F1/00 , F28D1/0477 , F28F1/325 , F28F17/00
摘要： Provided is a heat exchanger. The heat exchanger includes a refrigerant tube through which a refrigerant flows and a fin having at least two tube through holes in which the refrigerant tube is inserted. The fin includes a fin body, a plurality of flow guide protruding from one surface of the fin body, the plurality of flow guides being spaced apart from each other, and a plane part partitioning one flow guide and the other flow guide of the plurality of flow guides, the plane part having a flat surface.
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公开(公告)号：US20150136367A1
公开(公告)日：2015-05-21
申请号：US14590318
申请日：2015-01-06
申请人： LG ELECTRONICS INC.
发明人： Hongseong KIM , Sangyeul Lee , Yongcheol Sa , Hanchoon Lee
IPC分类号： F28D7/10
摘要： A heat exchanger is provided which may include a first heat exchange tube in a pipe shape, including a first fluid inlet, into which a first fluid may be introduced and flow, and a first fluid outlet, through which the first fluid may be discharged; a second heat exchange tube that passes through the first heat exchange tube, including a second fluid inlet, into which a second fluid may be introduced and flow, and a second fluid outlet, through which the second fluid may be discharged; and a third heat exchange tube that includes a third fluid inlet, into which the second fluid discharged through the second fluid outlet may be introduced and flow, and a third fluid outlet, through which the second fluid may be discharged, the third fluid outlet enclosing an external surface of the first heat exchange tube.
摘要翻译： 提供了一种热交换器，其可以包括管状的第一热交换管，包括第一流体入口和第一流体出口，第一流体入口可以被引入第一流体入口和第一流体出口，第一流体可以通过该第一流体出口排出; 第二热交换管，其穿过第一热交换管，包括第二流体入口，第二流体可以被引入并流动;第二流体出口，第二流体可以通过该第二流体出口排出; 以及第三热交换管，其包括第三流体入口，通过第二流体出口排出的第二流体可以被引入并流动到其中;第三流体出口，第二流体可以通过该第三流体出口排出，第三流体出口包围 第一换热管的外表面。
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公开(公告)号：US12111118B2
公开(公告)日：2024-10-08
申请号：US17501116
申请日：2021-10-14
申请人： LG ELECTRONICS INC.
发明人： Sungwoo Kim , Seungmo Jung , Hongseong Kim , Hanchoon Lee
摘要： A heat exchanger is provided that includes a tube panel module elongated in a vertical direction and including a plurality of first tube panels and a plurality of second tube panels that are alternately arranged in a lateral direction; header panel modules respectively formed at an upper end and a lower end of the tube panel module and elongated in the lateral direction; and a header case having an open one side, providing a space therein, and covered on the one side by the header panel module such that the plurality of first tube panels and the plurality of second tube panels communicate with the space. Each first tube panel is formed by bonding a first panel and a second panel, and each second tube panel is formed by bonding a third panel and a fourth panel. The header panel modules include a first header panel formed by bending both ends of the first panel and the second panel in opposite directions, and a second header panel formed by bending both ends of the third panel and the fourth panel in opposite directions and bonded to the first header panel between every first tube panel and second tube panel.
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