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公开(公告)号:US20210033349A1
公开(公告)日:2021-02-04
申请号:US16927028
申请日:2020-07-13
Applicant: LG ELECTRONICS INC.
Inventor: Jiwon Choi , Eungyul Lee , Hanchoon Lee
Abstract: A plate type heat exchanger according to an embodiment of the present disclosure includes a plate package in which a plurality of heat exchange plates is stacked to form a flow path, through which fluid flows, an end plate coupled to an outside of the plate package, and a socket connected to the plate package by passing through the end plate, in which the end plate includes a base which is in contact with the outside of the plate package, a socket hole which is formed through the base and into which the socket is inserted, and a ridge which protrudes outward from an edge of the socket hole of the base.
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公开(公告)号:US11592222B2
公开(公告)日:2023-02-28
申请号:US16648984
申请日:2018-09-19
Applicant: LG ELECTRONICS INC.
Inventor: Taegyun Park , Juhyok Kim , Jiwon Choi
Abstract: A condenser for a refrigerator according the present invention includes a heat exchange unit configured to receive at one side thereof refrigerant, which has been compressed in a compressor, to perform heat exchange between the refrigerant and air and to discharge the refrigerant, which has exchanged heat with the air, to an evaporator, wherein the heat exchange unit includes a flat tube, through one end of which the refrigerant is introduced and through a remaining end of which the refrigerant is discharged, thereby performing heat exchange between the refrigerant and the air, wherein the flat tube includes at least one bent tube portion defining plural rows of tubes, which are spaced apart from each other in an up-and-down direction, and wherein the plural rows of tubes define an intersection bent surface, which has a predetermined curvature and intersects the up-and-down direction.
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公开(公告)号:US12044487B2
公开(公告)日:2024-07-23
申请号:US16979768
申请日:2019-03-27
Applicant: LG ELECTRONICS INC.
Inventor: Eungyul Lee , Juhyok Kim , Jiwon Choi , Sanghoon Yoo , Hanchoon Lee
CPC classification number: F28F3/10 , C08J5/12 , C09J1/00 , C09J1/02 , C09J5/06 , F28D9/005 , F28F3/046 , F28F2275/025
Abstract: A plate-type heat exchanger and a method for manufacturing same are provided. A plate-type heat exchanger includes a first plate and a second plate which have flange parts vertically adhered by an adhesive, respectively. The flange parts are formed in a stepped shape and may thus increase an area adhered to the first plate and the second plate.
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公开(公告)号:US12104861B2
公开(公告)日:2024-10-01
申请号:US17621450
申请日:2020-07-09
Applicant: LG ELECTRONICS INC.
Inventor: Jiwon Choi , Sukyoung Lee , Hanchoon Lee
CPC classification number: F28D7/1607 , F28D7/12 , F28F9/22 , F28F2009/226
Abstract: A heat exchanger according to an embodiment of the present disclosure includes a housing, a gas inflow pipe configured to flow exhaust gas in the housing and a gas exhaust pipe configured to discharge the exhaust gas to the outside of the housing, a cooling water inflow pipe configured to flow cooling water in the housing and a cooling water outflow pipe configured to flow out the cooling water heat-exchanged with the exhaust gas to the outside of the housing, a plurality of tubes extending in the housing in the longitudinal direction of the housing and through which the cooling water flowing therein through the cooling water inflow pipe flows, and a plurality of baffles which are installed in the housing to insert the plurality of tubes thereinto and which are spaced apart from each other by a predetermined distance and are disposed, in which the baffle may be a first curved part configured to extend to be rounded with a first curvature, a first straight part configured to extend linearly from one end part of the first curved part, a second straight part configured to extend linearly from the other end part of the first curved part, and a second curved part positioned between the first and second straight parts and configured to extend to be rounded with a second curvature, and the first straight part and the second straight part may be formed in a direction crossing each other.
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公开(公告)号:US12130092B2
公开(公告)日:2024-10-29
申请号:US17425009
申请日:2020-01-28
Applicant: LG ELECTRONICS INC.
Inventor: Jiwon Choi , Hongseong Kim , Yohan Lee , Hanchoon Lee
CPC classification number: F28F1/40 , F28D7/16 , F28F13/12 , F28D2021/0071
Abstract: A heat transfer pipe includes an outer pipe having a space therein and extending a first direction, a core disposed in the space inside the outer pipe, defining a refrigerant flow space through which a refrigerant flows between an inner surface of the outer pipe and the core, and extending in the first direction, and a resistor disposed in the refrigerant flow space and having a spiral shape with a central axis disposed to be parallel to the first direction.
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公开(公告)号:US11353268B2
公开(公告)日:2022-06-07
申请号:US16927028
申请日:2020-07-13
Applicant: LG ELECTRONICS INC.
Inventor: Jiwon Choi , Eungyul Lee , Hanchoon Lee
Abstract: A plate type heat exchanger includes a plate package in which a plurality of heat exchange plates is stacked to form a flow path, through which fluid flows, an end plate coupled to an outside of the plate package, and a socket connected to the plate package by passing through the end plate. The end plate includes a base which is in contact with the outside of the plate package, a socket hole which is formed through the base and into which the socket is inserted, and a ridge that protrudes outward from an edge of the socket hole of the base.
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