Invention Application
- Patent Title: Structure and Formation Method of Semiconductor Device Structure with Gate Stack
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Application No.: US17066102Application Date: 2020-10-08
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Publication No.: US20210036128A1Publication Date: 2021-02-04
- Inventor: Bo-Feng Young , Che-Cheng Chang , Mu-Tsang Lin , Tung-Wen Cheng , Zhe-Hao Zhang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/49

Abstract:
Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a semiconductor substrate and a gate electrode over the semiconductor substrate. The semiconductor device structure also includes a source/drain structure adjacent to the gate electrode. The semiconductor device structure further includes a spacer element over a sidewall of the gate electrode, and the spacer element has an upper portion having a first exterior surface and a lower portion having a second exterior surface. Lateral distances between the first exterior surface and the sidewall of the gate electrode are substantially the same. Lateral distances between the second exterior surface and the sidewall of the gate electrode increase along a direction from a top of the lower portion towards the semiconductor substrate.
Public/Granted literature
- US11631748B2 Structure and formation method of semiconductor device structure with gate stack Public/Granted day:2023-04-18
Information query
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