Invention Application
- Patent Title: INTERPOSER PRINTED CIRCUIT BOARDS FOR POWER MODULES
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Application No.: US16528510Application Date: 2019-07-31
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Publication No.: US20210037649A1Publication Date: 2021-02-04
- Inventor: John Andrew Trelford , Richard John Yeager , Alok Kumar Lohia , Thang Danh Truong
- Applicant: ABB Power Electronics Inc.
- Applicant Address: US TX Plano
- Assignee: ABB Power Electronics Inc.
- Current Assignee: ABB Power Electronics Inc.
- Current Assignee Address: US TX Plano
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H01L23/00

Abstract:
Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board, an electrical component mounted on a surface of the printed circuit board, and an interposer printed circuit board mounted on the surface of the printed circuit board. The interposer printed circuit board may comprise a first signal path to transmit a first electrical signal and a second signal path to transmit a second electrical signal that is different from the first electrical signal. The interposer printed circuit board may be configured to provide a standoff to prevent the electrical component from contacting a motherboard when the printed circuit board assembly is mounted to the motherboard.
Public/Granted literature
- US11490517B2 Interposer printed circuit boards for power modules Public/Granted day:2022-11-01
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