- 专利标题： PLACING TABLE AND SUBSTRATE PROCESSING APPARATUS
-
申请号： US16987650申请日： 2020-08-07
-
公开(公告)号： US20210043476A1公开(公告)日： 2021-02-11
- 发明人: Katsuyuki Koizumi , Masanori Takahashi , Shota Ezaki
- 申请人： Tokyo Electron Limited
- 申请人地址： JP Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Tokyo
- 优先权： JP2019-148134 20190809
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; H01L21/3065 ; H01L21/683 ; H01L21/687
摘要：
A placing table configured to place a substrate on an electrostatic chuck includes a base; the electrostatic chuck placed on a placing surface of the base; and a path formed within the placing table along the placing surface, and configured to allow a heat exchange medium to flow therein from an inlet opening to an outlet opening of the heat exchange medium. A distance between a top surface of the path and the placing surface is constant from the inlet opening to the outlet opening. A cross sectional shape of the path in a direction perpendicular to the top surface is differed depending on a position in the path.
公开/授权文献
信息查询
IPC分类:
