- 专利标题: THREE-DIMENSIONAL MASK MODEL FOR PHOTOLITHOGRAPHY SIMULATION
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申请号: US17097106申请日: 2020-11-13
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公开(公告)号: US20210064811A1公开(公告)日: 2021-03-04
- 发明人: Peng LIU , Yu CAO , Luoqi CHEN , Jun YE
- 申请人: ASML NETHERLANDS B.V.
- 申请人地址: NL Veldhoven
- 专利权人: ASML NETHERLANDS B.V.
- 当前专利权人: ASML NETHERLANDS B.V.
- 当前专利权人地址: NL Veldhoven
- 主分类号: G06F30/398
- IPC分类号: G06F30/398 ; G03F7/20 ; G06F30/30 ; G03F1/76 ; G03F1/50
摘要:
A three-dimensional mask model that provides a more realistic approximation of the three-dimensional effects of a photolithography mask with sub-wavelength features than a thin-mask model. In one embodiment, the three-dimensional mask model includes a set of filtering kernels in the spatial domain that are configured to be convolved with thin-mask transmission functions to produce a near-field image. In another embodiment, the three-dimensional mask model includes a set of correction factors in the frequency domain that are configured to be multiplied by the Fourier transform of thin-mask transmission functions to produce a near-field image.
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