Invention Application
- Patent Title: SEMICONDUCTOR DEVICE PACKAGE, ELECTRONIC ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
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Application No.: US17140926Application Date: 2021-01-04
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Publication No.: US20210125909A1Publication Date: 2021-04-29
- Inventor: Cheng-Lin HO , Chih-Cheng LEE , Chun Chen CHEN , Chen Yuang CHEN
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/31 ; H01L21/56 ; H05K1/18 ; H05K3/34 ; H01L21/48
Abstract:
A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.
Public/Granted literature
- US11764137B2 Semiconductor device package, electronic assembly and method for manufacturing the same Public/Granted day:2023-09-19
Information query
IPC分类:
