公开(公告)号：US20210125909A1

公开(公告)日：2021-04-29

申请号：US17140926

申请日：2021-01-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Lin HO ,  Chih-Cheng LEE ,  Chun Chen CHEN ,  Chen Yuang CHEN

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H05K1/18 ,  H05K3/34 ,  H01L21/48

Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.

公开(公告)号：US20200251421A1

公开(公告)日：2020-08-06

申请号：US16264599

申请日：2019-01-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chen Yuang CHEN ,  Jiming LI ,  Chun Chen CHEN ,  Yuanhao YU

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/22 ,  H01Q1/52

Abstract: A semiconductor package includes a substrate, a preformed feeding element, a preformed shielding element, and an encapsulant. The preformed feeding element is disposed on the substrate and the preformed feeding element is disposed on the substrate and adjacent to the preformed feeding element. The encapsulant encapsulates the preformed feeding element and the preformed shielding element.