- 专利标题: MOLD DIE, METHOD OF MANUFACTURING MOLD DIE, INJECTION MOLDING APPARATUS, AND METHOD OF MANUFACTURING MOLD PRODUCT
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申请号: US16772467申请日: 2019-10-31
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公开(公告)号: US20210146582A1公开(公告)日: 2021-05-20
- 发明人: Tatsumi ONISHI , Yusuke MITSUI
- 申请人: KASAI KOGYO CO., LTD.
- 申请人地址: JP Kanagawa
- 专利权人: KASAI KOGYO CO., LTD.
- 当前专利权人: KASAI KOGYO CO., LTD.
- 当前专利权人地址: JP Kanagawa
- 优先权: JP2019-028196 20190220
- 国际申请: PCT/JP2019/042838 WO 20191031
- 主分类号: B29C45/26
- IPC分类号: B29C45/26 ; B29C33/38 ; B29C33/42 ; C23C18/32 ; C23C18/18
摘要:
A mold cavity which is a mold die includes a die body and a plating layer provided on the surface of a mold surface. In this case, the mold surface has a leather-grain transfer surface for forming a grain pattern. The leather-grain transfer surface includes a first uneven-shape part and a second uneven-shape part formed at the surface of the first uneven-shape part and smaller in an uneven-shape width than the first uneven-shape part. The uneven-shape width falls within a range of 10 μm or more and less than 500 μm. The plating layer is an electroless-plating layer. A thickness of at least part of the plating layer falls within a range of 0.1 μm or more and less than 10 μm.
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