公开(公告)号：US20210146582A1

公开(公告)日：2021-05-20

申请号：US16772467

申请日：2019-10-31

Applicant: KASAI KOGYO CO., LTD.

Inventor： Tatsumi ONISHI ,  Yusuke MITSUI

IPC: B29C45/26 ,  B29C33/38 ,  B29C33/42 ,  C23C18/32 ,  C23C18/18

Abstract: A mold cavity which is a mold die includes a die body and a plating layer provided on the surface of a mold surface. In this case, the mold surface has a leather-grain transfer surface for forming a grain pattern. The leather-grain transfer surface includes a first uneven-shape part and a second uneven-shape part formed at the surface of the first uneven-shape part and smaller in an uneven-shape width than the first uneven-shape part. The uneven-shape width falls within a range of 10 μm or more and less than 500 μm. The plating layer is an electroless-plating layer. A thickness of at least part of the plating layer falls within a range of 0.1 μm or more and less than 10 μm.