When forming layer stacks in the presence of solder material, uncontrolled flow of the solder material at the interface of two different layers of the layer stack may significantly be mitigated by providing an area of increased pressure in the material of the overlaying foil layer. For example, the area of increased pressure may be generated during the lamination process by providing a pressure inducing structure, for instance on the underlying foil layer, which laterally surrounds the solder material and therefore, in combination with the material of the overlying foil layer, reliably confines the solder material.