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51 条记录 (耗时 0.025 秒)

    Process for manufacturing a roll of flexible carrier for electronic components
    1.
    发明授权
    Process for manufacturing a roll of flexible carrier for electronic components 有权

    公开(公告)号：US11412620B2

    公开(公告)日：2022-08-09

    申请号：US16973529

    申请日：2019-06-12

    申请人： Linxens Holding

    发明人： Christophe Mathieu

    IPC分类号： H05K3/32

    摘要： The invention relates to a process for manufacturing a roll of flexible carrier bearing electronic components. This process includes a step consisting in adding, to this flexible carrier, electronic components, themselves manufactured from a roll of flexible initial substrate. For example, the electronic components may be manufactured on an initial substrate having a width allowing advantage to be taken of densification of the manufacture of the components on this initial substrate. Subsequently, the singulated electronic components are added to the flexible carrier, allowing, for example, packaging that is more suitable, than possible with the initial substrate, to a use of the electronic components, notably when the latter must be integrated into a chip-card. Thus, for example, the flexible carrier may be, or include, an adhesive, which may or may not be conductive, and which is used to fasten, and optionally connect, each electronic component to a chip-card.

    Chip Card, Antenna Support for a Chip Card and Method for Manufacturing an Antenna Support for a Chip Card
    2.
    发明申请
    Chip Card, Antenna Support for a Chip Card and Method for Manufacturing an Antenna Support for a Chip Card 有权

    公开(公告)号：US20220114411A1

    公开(公告)日：2022-04-14

    申请号：US17418905

    申请日：2019-01-31

    申请人： Linxens Holding

    发明人： Yean Wei YEAP ,  Minli Cindy NG ,  Wen Qiang CHIN

    IPC分类号： G06K19/077 ,  G06K19/07 ,  H01Q1/22

    摘要： The invention relates to a chip card designed to communicate data in a contactless mode with a card reader operating at a reading frequency. The resonance frequency of the chip card may change according to the capacitance of the chip used in the contactless mode of the chip card. In order to be able to use various chips without changing the booster antenna design, the card antenna circuit is provided with a capacitance element such that the chip card including the card antenna circuit and the chip module has two different resonance frequencies, one of which being equal to, or lower than, the reading frequency and the other being equal to, or greater, than the reading frequency. This create a broadband wherein the reading frequency falls.

    Light-emitting device and method for manufacturing same
    4.
    发明授权
    Light-emitting device and method for manufacturing same 有权

    公开(公告)号：US11166369B2

    公开(公告)日：2021-11-02

    申请号：US16321324

    申请日：2017-07-28

    申请人： LINXENS HOLDING

    发明人： Eric Eymard ,  Christophe Mathieu ,  Jerome Deschamps

    IPC分类号： F21V19/00 ,  F21V21/002 ,  F21S4/20 ,  H05K1/02 ,  H05K3/10 ,  H05K3/32 ,  H05K1/18 ,  F21V21/35 ,  F21S4/24 ,  F21S4/26 ,  F21S4/22 ,  H05K1/11

    摘要： A light radiation emitting device including at least one LED-type device capable of generating a light radiation in a predefined wavelength range and having two electrical contact pads, and a support delimited by first and second opposite sides defining together a thickness of the support, the support supporting at least one LED luminous device and at least one conductive electric track. The electric track is formed of conductive wires. All or part of the conductive wires are bonded to the support along all or part of their length. All or part of the conductive wires have at least one contact portion exposed towards at least one of the first and second sides of the support. Each of the contact pads of the LED-type device is positioned opposite a contact portion of one of the conductive wires and is electrically connected to the contact portion.

    LAMINATED FOIL STRUCTURE AND METHOD OF FORMING THE SAME
    5.
    发明申请
    LAMINATED FOIL STRUCTURE AND METHOD OF FORMING THE SAME 有权

    公开(公告)号：US20210154974A1

    公开(公告)日：2021-05-27

    申请号：US17103502

    申请日：2020-11-24

    申请人： Linxens Holding

    发明人： Carsten NIELAND

    IPC分类号： B32B7/12 ,  B32B15/04 ,  B32B27/06 ,  B32B27/30 ,  B32B27/36 ,  B23K1/00

    摘要： When forming layer stacks in the presence of solder material, uncontrolled flow of the solder material at the interface of two different layers of the layer stack may significantly be mitigated by providing an area of increased pressure in the material of the overlaying foil layer. For example, the area of increased pressure may be generated during the lamination process by providing a pressure inducing structure, for instance on the underlying foil layer, which laterally surrounds the solder material and therefore, in combination with the material of the overlying foil layer, reliably confines the solder material.

    Method of Producing an Electronic Circuit with Protection of the Conductive Layer
    10.
    发明申请
    Method of Producing an Electronic Circuit with Protection of the Conductive Layer 有权
    生产导电层保护电子电路的方法

    公开(公告)号：US20150181723A1

    公开(公告)日：2015-06-25

    申请号：US14406544

    申请日：2013-06-12

    申请人： Linxens Holding

    发明人： Severine Dieu-Gomont ,  Francois Lechleiter ,  Yannick Maquille

    IPC分类号： H05K3/32

    CPC分类号： H05K3/32 ,  H05K1/189 ,  H05K3/0017 ,  H05K3/002 ,  H05K3/06 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/10106 ,  Y10T29/49133

    摘要： The invention concerns a method of producing a circuit including the step consisting of connecting, to a bottom wall of a cavity, an electronic component with or without an intermediate wired link, the method including a step prior to an etching step which consists of depositing a layer of protective material on a conductive layer in the bottom of the cavity, said material being a liquid material capable of hardening and, once hardened, resistant to the etching solution.

    摘要翻译： 本发明涉及一种制造电路的方法，包括该步骤包括将空腔的底壁连接到具有或不具有中间有线链路的电子部件，所述方法包括在蚀刻步骤之前的步骤，该步骤包括： 在空腔底部的导电层上的保护材料层，所述材料是能够硬化并且一旦硬化的耐蚀刻溶液的液体材料。