- 专利标题: 3D NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME
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申请号: US16853839申请日: 2020-04-21
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公开(公告)号: US20210193574A1公开(公告)日: 2021-06-24
- 发明人: Zhongwang SUN , Zhong ZHANG , Wenxi ZHOU , Zhiliang XIA
- 申请人: Yangtze Memory Technologies Co., Ltd.
- 申请人地址: CN Wuhan
- 专利权人: Yangtze Memory Technologies Co., Ltd.
- 当前专利权人: Yangtze Memory Technologies Co., Ltd.
- 当前专利权人地址: CN Wuhan
- 主分类号: H01L23/528
- IPC分类号: H01L23/528 ; H01L27/11519 ; H01L27/11556 ; H01L27/11565 ; H01L27/11582 ; H01L23/522 ; H01L23/535 ; H01L21/768
摘要:
A semiconductor device is provided. The semiconductor device includes a substrate, a stack of word line layers and insulating layers that are stacked alternatingly over the substrate, and channel structures formed in a first array region and a second array region of the stack. The first array region and the second array region are positioned at opposing sides of the stack. A first staircase is formed in a connection region of the stack over the substrate, where the connection region is arranged between the first and second array regions. A second staircase is formed in the connection region of the stack over the substrate, and the connection region in the stack includes a separation region between the first and second staircases.
公开/授权文献
- US11342264B2 3D NAND memory device and method of forming the same 公开/授权日:2022-05-24
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