Invention Application
- Patent Title: WIRED CIRCUIT BOARD AND PRODUCTION METHOD THEREOF
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Application No.: US17237616Application Date: 2021-04-22
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Publication No.: US20210243900A1Publication Date: 2021-08-05
- Inventor: Shusaku SHIBATA , Takahiro TAKANO , Hayato TAKAKURA , Yoshihiro KAWAMURA , Shuichi WAKAKI
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Priority: JP2016-232481 20161130
- Main IPC: H05K3/10
- IPC: H05K3/10 ; H05K1/02

Abstract:
An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0
Public/Granted literature
- US11266024B2 Wired circuit board and production method thereof Public/Granted day:2022-03-01
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