发明申请
- 专利标题: CIRCUIT BOARD
-
申请号: US17032244申请日: 2020-09-25
-
公开(公告)号: US20210267047A1公开(公告)日: 2021-08-26
- 发明人: Chia-En Fan , Hui-Yu Huang , Chih-Ming Peng , Chun-Te Lee
- 申请人: CHIPBOND TECHNOLOGY CORPORATION
- 申请人地址: TW Hsinchu
- 专利权人: CHIPBOND TECHNOLOGY CORPORATION
- 当前专利权人: CHIPBOND TECHNOLOGY CORPORATION
- 当前专利权人地址: TW Hsinchu
- 优先权: TW109106342 20200226
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; H05K1/11
摘要:
A circuit board disclosed in the present invention includes a substrate and a circuit layer. The circuit layer is formed on a surface of the substrate and includes at least one test circuit line. The test circuit line includes a main segment and a branch segment connected with each other. The branch segment is provided to be contacted with a test equipment for electrical test so as to protect the main segment from breaking during electrical test.
公开/授权文献
- US11234328B2 Circuit board 公开/授权日:2022-01-25
信息查询