公开(公告)号：US11234328B2

公开(公告)日：2022-01-25

申请号：US17032244

申请日：2020-09-25

申请人： CHIPBOND TECHNOLOGY CORPORATION

发明人： Chia-En Fan ,  Hui-Yu Huang ,  Chih-Ming Peng ,  Chun-Te Lee

IPC分类号： H05K1/02 ,  H05K1/11

摘要： A circuit board disclosed in the present invention includes a substrate and a circuit layer. The circuit layer is formed on a surface of the substrate and includes at least one test circuit line. The test circuit line includes a main segment and a branch segment connected with each other. The branch segment is provided to be contacted with a test equipment for electrical test so as to protect the main segment from breaking during electrical test.

公开(公告)号：US20210267047A1

公开(公告)日：2021-08-26

申请号：US17032244

申请日：2020-09-25

申请人： CHIPBOND TECHNOLOGY CORPORATION

发明人： Chia-En Fan ,  Hui-Yu Huang ,  Chih-Ming Peng ,  Chun-Te Lee

IPC分类号： H05K1/02 ,  H05K1/11

摘要： A circuit board disclosed in the present invention includes a substrate and a circuit layer. The circuit layer is formed on a surface of the substrate and includes at least one test circuit line. The test circuit line includes a main segment and a branch segment connected with each other. The branch segment is provided to be contacted with a test equipment for electrical test so as to protect the main segment from breaking during electrical test.