- 专利标题： SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
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申请号： US16809500申请日： 2020-03-04
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公开(公告)号： US20210280744A1公开(公告)日： 2021-09-09
- 发明人: Tang-Yuan CHEN , Meng-Wei HSIEH , Cheng-Yuan KUNG
- 申请人： Advanced Semiconductor Engineering, Inc.
- 申请人地址： TW Kaohsiung
- 专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人地址： TW Kaohsiung
- 主分类号： H01L33/14
- IPC分类号： H01L33/14 ; H01L33/00
摘要：
A semiconductor device package includes a carrier, an emitting element and a first package body. The carrier includes a first surface and a second surface opposite to the first surface. The emitting element is disposed on the first surface of the carrier. The first package body is disposed over the first surface of the carrier and spaced apart from the first surface of the carrier.
公开/授权文献
- US11594660B2 Semiconductor device package 公开/授权日：2023-02-28
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