- 专利标题: METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MULTILAYER CERAMIC ELECTRONIC COMPONENT
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申请号: US17364330申请日: 2021-06-30
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公开(公告)号: US20210327650A1公开(公告)日: 2021-10-21
- 发明人: Du Won CHOI , Seok Kyoon WOO , Ji Hong JO
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2018-0118729 20181005
- 主分类号: H01G4/30
- IPC分类号: H01G4/30 ; C01F11/18 ; H01G4/012 ; H01G4/12 ; H01G4/232
摘要:
A method of manufacturing a multilayer ceramic electronic component includes: preparing a dielectric magnetic composition including base material powder particles including BaTi2O5 or (Ba(1-x)Cax)Ti2O5 (0≤x≤0.1), the base material powder particles having surfaces coated with one or more of Mg, Mn, V, Ba, Si, Al and a rare earth metal; preparing ceramic green sheets using dielectric slurry including the dielectric magnetic composition; applying an internal electrode paste to the ceramic green sheets; preparing a green sheet laminate by stacking the ceramic green sheets to which the internal electrode paste is applied; and preparing a ceramic body including dielectric layers and a plurality of first and second internal electrodes arranged to face each other with each of the dielectric layers interposed therebetween by sintering the green sheet laminate.
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