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    METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MULTILAYER CERAMIC ELECTRONIC COMPONENT
    1.
    发明申请
    METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权

    公开(公告)号：US20210327650A1

    公开(公告)日：2021-10-21

    申请号：US17364330

    申请日：2021-06-30

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Du Won CHOI ,  Seok Kyoon WOO ,  Ji Hong JO

    IPC: H01G4/30 ,  C01F11/18 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232

    Abstract: A method of manufacturing a multilayer ceramic electronic component includes: preparing a dielectric magnetic composition including base material powder particles including BaTi2O5 or (Ba(1-x)Cax)Ti2O5 (0≤x≤0.1), the base material powder particles having surfaces coated with one or more of Mg, Mn, V, Ba, Si, Al and a rare earth metal; preparing ceramic green sheets using dielectric slurry including the dielectric magnetic composition; applying an internal electrode paste to the ceramic green sheets; preparing a green sheet laminate by stacking the ceramic green sheets to which the internal electrode paste is applied; and preparing a ceramic body including dielectric layers and a plurality of first and second internal electrodes arranged to face each other with each of the dielectric layers interposed therebetween by sintering the green sheet laminate.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    3.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权

    公开(公告)号：US20210090802A1

    公开(公告)日：2021-03-25

    申请号：US17117210

    申请日：2020-12-10

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Du Won CHOI ,  Ji Hong JO ,  Seok Kyoon WOO

    IPC: H01G4/12 ,  H01G4/012 ,  H01G4/008 ,  H01G4/232

    Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of first and second internal electrodes disposed on the dielectric layers to face each other with each of the dielectric layers interposed therebetween; and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes, wherein the dielectric layer includes a dielectric ceramic composition including a base material main component represented by z(Ba(1-x)Ca.)TiO3-(1-z)BaTi205 including a first main component represented by (Ba(1-x)Ca.)TiO3 and a second main component represented by BaTi2O5, 0.7z0.8 and 0≤x

    MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME
    6.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME 有权
    多层陶瓷电容器及其安装板

    公开(公告)号：US20140185186A1

    公开(公告)日：2014-07-03

    申请号：US13899279

    申请日：2013-05-21

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Byoung Hwa LEE ,  Young Ghyu AHN ,  Sang Soo PARK ,  Seok Kyoon WOO ,  Tae Hyeok KIM ,  Heung Kil PARK

    IPC: H01G4/01

    CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/012 ,  H01G4/232 ,  H05K3/3442 ,  H05K2201/10015

    Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are laminated; a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body with the dielectric layer interposed therebetween; and first and second external electrodes covering both end surfaces of the ceramic body, wherein the ceramic body includes an active layer forming capacitance by including the plurality of first and second internal electrodes and a cover layer formed on an upper portion or a lower portion of the active layer, wherein the active layer includes a first block in which a first region I, and a second region II, and a second block in which a third region III, and a fourth region IV.

    Abstract translation: 提供了一种多层陶瓷电容器，包括：层叠有多个电介质层的陶瓷体; 多个第一和第二内部电极被形成为交替地暴露于陶瓷体的两个端面，其间插入介电层; 以及覆盖陶瓷体的两端面的第一外部电极和第二外部电极，其中陶瓷体包括通过包括多个第一和第二内部电极的有源层形成电容和形成在所述陶瓷体的上部或下部的覆盖层 活性层，其中所述有源层包括第一区块，其中第一区域I和第二区域II以及其中第三区域III和第四区域IV的第二区段。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    7.
    发明公开
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20240038446A1

    公开(公告)日：2024-02-01

    申请号：US18241392

    申请日：2023-09-01

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Du Won CHOI ,  Ji Hong JO ,  Seok Kyoon WOO

    IPC: H01G4/12 ,  H01G4/012 ,  H01G4/008 ,  H01G4/232

    CPC classification number: H01G4/1227 ,  H01G4/012 ,  H01G4/008 ,  H01G4/2325 ,  H01G4/129 ,  H01G4/30

    Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of first and second internal electrodes disposed on the dielectric layers to face each other with each of the dielectric layers interposed therebetween; and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes, wherein the dielectric layer includes a dielectric ceramic composition including a base material main component represented by z(Ba(1-x)Ca.)TiO3-(1-z)BaTi205 including a first main component represented by (Ba(1-x)Ca.)TiO3 and a second main component represented by BaTi2O5, 0.7z0.8 and 0≤x

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    8.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20210090812A1

    公开(公告)日：2021-03-25

    申请号：US17110860

    申请日：2020-12-03

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Seok Kyoon WOO ,  Kyoung Jin CHA ,  Jeong Ryeol KIM ,  Ji Hong JO

    IPC: H01G4/30 ,  H01G4/12 ,  H01G4/008

    Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming an internal electrode pattern by applying a paste for an internal electrode including a conductive powder to the ceramic green sheet, forming a ceramic laminate structure by layering the ceramic green sheet on which the internal electrode pattern is formed, forming a body including a dielectric layer and an internal electrode by sintering the ceramic laminate structure, and forming an external electrode by forming an electrode layer on the body, and forming a conductive resin layer on the electrode layer, and the conductive powder includes a conductive metal and tin (Sn), and a content of tin (Sn) is 1.5 wt % or higher, based on a weight of the conductive metal.

    MULTILAYER CERAMIC CAPACITOR AND MOUNTING BOARD THEREFOR
    9.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND MOUNTING BOARD THEREFOR 有权
    多层陶瓷电容器及其安装板

    公开(公告)号：US20140182910A1

    公开(公告)日：2014-07-03

    申请号：US13941075

    申请日：2013-07-12

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Young Ghyu AHN ,  Min Cheol PARK ,  Seok Kyoon WOO ,  Sang Soo PARK

    IPC: H01G4/12 ,  H05K1/18

    CPC classification number: H01G4/12 ,  H01G2/06 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/2045

    Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body having dielectric layers laminated in a width direction thereof; an active region in which capacitance is formed, by including first and second internal electrodes alternately exposed to end surfaces of the ceramic body while having the dielectric layer interposed therebetween; an upper margin part prepared above the active region; a lower margin part prepared below the active region on the dielectric layer and being thicker than the upper margin part; and first and second external electrodes, wherein, when half of thickness of the ceramic body is denoted by A, thickness of the lower margin part is denoted by B, half of thickness of the active region is denoted by C, and thickness of the upper margin part is denoted by D, 1.047≦(B+C)/A≦1.562 is satisfied.

    Abstract translation: 提供了一种多层陶瓷电容器，其包括：具有在其宽度方向上层压的电介质层的陶瓷体; 通过包括交替地暴露于陶瓷体的端面的第一和第二内部电极，同时具有介电层，形成电容的有源区; 在活性区上方制备的上边缘部分; 在所述电介质层上的有源区下面制备并且比所述上边缘部分更厚的下边缘部分; 以及第一外部电极和第二外部电极，其中当陶瓷体的厚度的一半由A表示时，下部边缘部分的厚度由B表示，有源区域的厚度的一半由C表示，上部的厚度 边缘部分由D表示，1.047＆nlE;（B + C）/A≦̸1.562。

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