The light emitting device according to an embodiment of the present disclosure includes: a substrate; a semiconductor stacked body; a first electrically conductive layer; a second electrically conductive layer; and a through wiring line. The substrate has a first surface and a second surface that are opposed to each other. The semiconductor stacked body is provided on the first surface of the substrate. The semiconductor stacked body has a plurality of light emitting regions each of which allows a laser beam to be emitted. The first electrically conductive layer is provided on a front surface of the semiconductor stacked body. The front surface is opposite to the substrate. The second electrically conductive layer is provided on the second surface of the substrate. The second electrically conductive layer is provided to allow a predetermined voltage to be applied to the semiconductor stacked body in each of a plurality of the light emitting regions. The through wiring line electrically couples the first electrically conductive layer and the second electrically conductive layer.