- 专利标题: INTEGRATED CIRCUIT DEVICE
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申请号: US17168952申请日: 2021-02-05
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公开(公告)号: US20210398569A1公开(公告)日: 2021-12-23
- 发明人: Jiseok Hong , Sangho Lee , Seoryong Park , Jiyoung Ahn , Kiseok Lee , Kiseok Lee , Yoonyoung Choi , Seunguk Han
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2020-0076763 20200623
- 主分类号: G11C5/06
- IPC分类号: G11C5/06 ; H01L27/108
摘要:
An integrated circuit device includes: a substrate including a plurality of active regions; a bit line extending on the substrate in a horizontal direction; a direct contact connected between a first active region selected among the plurality of active regions and the bit line; an inner oxide layer contacting a sidewall of the direct contact; and a carbon-containing oxide layer nonlinearly extending on a sidewall of the bit line in a vertical direction, the carbon-containing oxide layer contacting the sidewall of the bit line.
公开/授权文献
- US11647627B2 Integrated circuit device 公开/授权日:2023-05-09
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