Invention Application
- Patent Title: VERSATILE ADAPTOR FOR HIGH COMMUNICATION LINK PACKING DENSITY
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Application No.: US17484768Application Date: 2021-09-24
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Publication No.: US20220012206A1Publication Date: 2022-01-13
- Inventor: Kevin BROSS , Benjamin CHEONG , Danae A. BERGE , April E. FISHER
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F13/42

Abstract:
An adaptor is described. The adaptor includes a first interface. The first interface is designed to support traffic and command flows to multiple transceivers through a single instance of the first interface. The adaptor includes multiple interfaces on a transceiver side. The multiple interfaces are to mate to respective transceivers. The multiple interfaces are different than the first interface, wherein the first interface is a QSFP interface and the multiple interfaces are SFP interfaces. The adaptor includes a flex cable between the first interface and the multiple interfaces. The adaptor includes electronic circuitry to translate QSFP commands received at the first interface into SFP commands presented to the respective transceivers through the multiple interfaces.
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