Invention Application
- Patent Title: SHEET MOLDING COMPOUND AND FIBER-REINFORCED COMPOSITE MATERIAL
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Application No.: US17277385Application Date: 2019-11-01
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Publication No.: US20220033641A1Publication Date: 2022-02-03
- Inventor: Norikazu ISHIKAWA , Kazunori HONDO , Nobuyuki TOMIOKA
- Applicant: TORAY INDUSTRIES, INC.
- Applicant Address: JP Tokyo
- Assignee: TORAY INDUSTRIES, INC.
- Current Assignee: TORAY INDUSTRIES, INC.
- Current Assignee Address: JP Tokyo
- Priority: JP2018-220984 20181127
- International Application: PCT/JP2019/042995 WO 20191101
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08J5/04

Abstract:
The present invention enables the achievement of: an SMC which has excellent flexibility, while being suppressed in tackiness; and a fiber-reinforced composite material which uses this SMC, thereby being reduced in voids after molding. In order to achieve the above, a sheet molding compound according to the present invention has the configuration described below. Specifically, a sheet molding compound according to the present invention is formed from reinforcing fibers and a resin composition, and has a weight content of the fibers of from 40% to 60% (inclusive) and an air bubble content of from 5% by volume to 30% by volume (inclusive), while satisfying the formulae below in a dynamic viscoelasticity measurement at 25° C. 105 Pa G′ (s)≤109 Pa 1≤G′(s)/G″ (s)≤5 G′(s): storage elastic modulus (Pa) of sheet molding compound at 25° C. G″(s): loss elastic modulus (Pa) of sheet molding compound at 25° C.
Information query