公开(公告)号：US20220033641A1

公开(公告)日：2022-02-03

申请号：US17277385

申请日：2019-11-01

Applicant: TORAY INDUSTRIES, INC.

Inventor： Norikazu ISHIKAWA ,  Kazunori HONDO ,  Nobuyuki TOMIOKA

IPC: C08L63/00 ,  C08J5/04

Abstract: The present invention enables the achievement of: an SMC which has excellent flexibility, while being suppressed in tackiness; and a fiber-reinforced composite material which uses this SMC, thereby being reduced in voids after molding. In order to achieve the above, a sheet molding compound according to the present invention has the configuration described below. Specifically, a sheet molding compound according to the present invention is formed from reinforcing fibers and a resin composition, and has a weight content of the fibers of from 40% to 60% (inclusive) and an air bubble content of from 5% by volume to 30% by volume (inclusive), while satisfying the formulae below in a dynamic viscoelasticity measurement at 25° C. 105 Pa G′ (s)≤109 Pa 1≤G′(s)/G″ (s)≤5 G′(s): storage elastic modulus (Pa) of sheet molding compound at 25° C. G″(s): loss elastic modulus (Pa) of sheet molding compound at 25° C.

公开(公告)号：US20240150517A1

公开(公告)日：2024-05-09

申请号：US17773110

申请日：2020-12-02

Applicant: TORAY INDUSTRIES, INC.

Inventor： Norikazu ISHIKAWA ,  Tatsuya TAKAMOTO ,  Nobuyuki TOMIOKA

IPC: C08G18/58 ,  C08G18/38 ,  C08G18/75 ,  C08G18/76 ,  C08G18/79 ,  C08J5/24 ,  C08K3/04 ,  C08K7/06

CPC classification number: C08G18/58 ,  C08G18/3819 ,  C08G18/388 ,  C08G18/755 ,  C08G18/758 ,  C08G18/7621 ,  C08G18/7664 ,  C08G18/7671 ,  C08G18/792 ,  C08G18/797 ,  C08J5/243 ,  C08K3/04 ,  C08K7/06

Abstract: The purposes of the present invention are: to provide an epoxy resin composition having excellent impregnation into reinforcing fibers, excellent shapability under low-temperature conditions after thickening, and excellent heat resistance after curing; to provide a molding material for a fiber-reinforced composite material, said molding material having excellent shapability during handling and excellent fluidity during press molding; and to provide a fiber-reinforced composite material having excellent heat resistance and bending strength. To achieve the abovementioned purposes, the present invention provides an epoxy resin composition containing all of the following components (A)-(D), wherein: the content of the component (A), in terms of 100 mass % of the total mass of the epoxy resin composition, is 30-95 mass %; and the ratio Wc/Wd of the content We of the component (C) to the content Wd of the component (D) is 0.01-10. Component (A) is an epoxy resin; component (B) is a curing agent; component (C) is a diisocyanate compound having consecutive double bonds, an alicyclic structure or a heterocyclic structure; and component (D) is a polyisocyanate compound excluding the component (C).

公开(公告)号：US20240026097A1

公开(公告)日：2024-01-25

申请号：US18024579

申请日：2021-09-06

Applicant: TORAY INDUSTRIES, INC.

Inventor： Tatsuya TAKAMOTO ,  Norikazu ISHIKAWA ,  Nobuyuki TOMIOKA

IPC: C08J5/04 ,  C08L63/00

CPC classification number: C08J5/042 ,  C08L63/00 ,  C08J2363/00

Abstract: The present invention aims to provide: an epoxy resin composition in which the effect of adding an additive can be efficiently obtained even at a high temperature; a molding material which achieves a reduced unevenness in physical properties after curing while allowing the additive to exert its effect; and a fiber-reinforced composite material which has excellent mechanical properties while allowing the additive to exert its effect.
To achieve the above-mentioned object, the epoxy resin composition according to the present invention is an epoxy resin composition including the following components (A) to (E): component (A): an epoxy resin having a viscosity at 25° C. of from 0.1 to 1,000 Pa·s and having two or more epoxy groups within one molecule; component (B): an additive having a viscosity at 25° C. of from 0.01 to 20 Pa·s; component (C): a compound that undergoes a thickening reaction with the epoxy resin at a temperature equal to or lower than a curing temperature; component (D): an epoxy curing agent; and component (E): particles that give thixotropic property. In this epoxy resin composition, the dispersion diameter of the component (B), in a cured product obtained by heat-treating the epoxy resin composition at the curing temperature for 2 hours, is from 0.01 to 5 μm.

公开(公告)号：US20230030598A1

公开(公告)日：2023-02-02

申请号：US17786602

申请日：2021-01-27

Applicant: TORAY INDUSTRIES, INC.

Inventor： Tatsuya TAKAMOTO ,  Norikazu ISHIKAWA ,  Nobuyuki TOMIOKA

IPC: C08J5/04

Abstract: The purpose of the present invention is to provide: an epoxy resin composition having both excellent dispersibility of a solid curing agent and excellent impregnation of reinforcing fibers; a molding material for the fiber-reinforced composite material that has excellent dispersibility of the solid curing agent in the post-thickened resin; and a fiber-reinforced composite material that has excellent appearance quality and mechanical characteristics and little unevenness in physical properties. In order to achieve the aforementioned purpose, this epoxy resin composition has the following configuration. The epoxy resin composition includes all components (A)-(C). The degree of dispersion of component (B) in component (A) is 0.1-0.8, the viscosity at 25° C. is 0.1-100 Pa·s, and the glass transition temperature of an epoxy resin cured product at any hardness between 85%-95% is at least 110° C. Component (A): An epoxy resin having at least two epoxy groups in each molecule Component (B): A solid curing agent Component (C): A dispersant miscible with component (A)