Invention Application
- Patent Title: COPPER-CLAD LAMINATE AND METHOD OF FORMING THE SAME
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Application No.: US17443386Application Date: 2021-07-26
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Publication No.: US20220039256A1Publication Date: 2022-02-03
- Inventor: Jennifer ADAMCHUK , Gerard T. Buss , Theresa M. Besozzi
- Applicant: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION
- Applicant Address: US OH Solon
- Assignee: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION
- Current Assignee: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION
- Current Assignee Address: US OH Solon
- Main IPC: H05K1/05
- IPC: H05K1/05 ; H05K3/44 ; C09D5/24 ; C09D127/12
Abstract:
The present disclosure relates to a copper-clad laminate that may include a copper foil layer and a dielectric coating overlying the copper foil layer. The dielectric coating may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The dielectric coating may have an average thickness of not greater than about 20 microns.
Information query
