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公开(公告)号：US20230164914A1
公开(公告)日：2023-05-25
申请号：US18157918
申请日：2023-01-23
Inventor： Jennifer ADAMCHUK , Gerard T. Buss , Theresa M. Besozzi
CPC classification number: H05K1/0373 , H05K1/09 , H05K1/05 , H05K2201/0358
Abstract: The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.
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公开(公告)号：US20240023242A1
公开(公告)日：2024-01-18
申请号：US18471816
申请日：2023-09-21
Inventor： Jennifer ADAMCHUK , Gerard T. BUSS , Theresa M. BESOZZI
CPC classification number: H05K1/0373 , H05K1/09 , H05K1/05 , H05K2201/0358
Abstract: The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.
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公开(公告)号：US20210394465A1
公开(公告)日：2021-12-23
申请号：US17348055
申请日：2021-06-15
Inventor： Steven R. DUBRULE , Jennifer ADAMCHUK , Nicole LOVE
IPC: B29C70/54 , C09D5/00 , C08L101/00
Abstract: The present disclosure relates to a multifunctional film for a vacuum bag that may include a flexible barrier film that may include a textured surface. The multifunctional film may further include a release coating overlying the textured surface of the flexible barrier film. The multifunctional film may further have an oxygen (O2) permeability of not greater than about 1100 cc/(m2-day-atm) and a stability rating of not greater than about 90%, where the stability rating is defined as the maximum percent decrease in elongation at break as measured using ASTM D882 after being exposed to a temperature of 200° C. for 12 hours.
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公开(公告)号：US20230191750A1
公开(公告)日：2023-06-22
申请号：US18065989
申请日：2022-12-14
Inventor： Jennifer ADAMCHUK , Dale THOMAS , Meghann WHITE , Sethumadhavan RAVICHANDRAN
IPC: B32B15/085 , B32B15/20 , B32B27/20 , B32B27/32
CPC classification number: B32B15/085 , B32B15/20 , B32B27/20 , B32B27/322 , B32B2264/107 , B32B2262/124 , B32B2264/12 , B32B2264/303
Abstract: The present disclosure relates to a dielectric substrate that may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 microns and not greater than about 1.7, a D50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D90 of at least about 2.7 microns and not greater than about 6 microns.
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公开(公告)号：US20220186081A1
公开(公告)日：2022-06-16
申请号：US17643446
申请日：2021-12-09
Inventor： Jennifer ADAMCHUK , Dale THOMAS , Meghann White , Sethumadhavan Ravichandran , Gerard T. Buss
IPC: C09J7/24 , C09J11/04 , C09J7/38 , H05K1/09 , H05K1/03 , B32B7/12 , B32B27/20 , B32B15/20 , B32B15/08 , B32B27/28
Abstract: The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 microns and not greater than about 1.7, a D50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D90 of at least about 2.7 microns and not greater than about 6 microns.
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Patent Agency Ranking
公开(公告)号：US20230191761A1
公开(公告)日：2023-06-22
申请号：US18065955
申请日：2022-12-14
Inventor： Jennifer ADAMCHUK , Dale Thomas , Meghann White , Sethumadhavan Ravichandran
IPC: B32B27/20 , C08K3/36 , C08K3/22 , B32B7/02 , B32B5/02 , B32B7/12 , B32B27/32 , B32B27/12 , B32B27/08 , H05K1/02
CPC classification number: B32B27/20 , C08K3/36 , C08K3/22 , B32B7/02 , B32B5/022 , B32B5/024 , B32B7/12 , B32B27/322 , B32B27/12 , B32B27/08 , H05K1/0271 , C08K2003/2241 , B32B2262/101 , B32B2264/107 , B32B2264/303 , B32B2307/732 , B32B2307/54 , B32B2307/204 , B32B2457/08 , H05K1/0366
Abstract: The present disclosure relates to a dielectric composite may include a dielectric substrate overlying a reinforcement fabric layer. The dielectric substrate may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 microns and not greater than about 1.7, a D50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D90 of at least about 2.7 microns and not greater than about 6 microns.
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公开(公告)号：US20220039254A1
公开(公告)日：2022-02-03
申请号：US17443390
申请日：2021-07-26
Inventor： Jennifer ADAMCHUK , Gerard T. BUSS , Theresa M. BESOZZI
Abstract: The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.
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公开(公告)号：US20220033617A1
公开(公告)日：2022-02-03
申请号：US17443385
申请日：2021-07-26
Inventor： Jennifer ADAMCHUK , Gerard T. Buss , Theresa M. Besozzi
Abstract: The present disclosure relates to a dielectric substrate that may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 microns and not greater than about 1.7, a D50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D90 of at least about 2.7 microns and not greater than about 6 microns.
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公开(公告)号：US20180072824A1
公开(公告)日：2018-03-15
申请号：US15813424
申请日：2017-11-15
Inventor： Jessica L. MCCOY , Georges MOINEAU , Philip C. GUY , Mark E. SCHIEK , Joseph B. MACDONALD , Frank M. KEESE , Jennifer ADAMCHUK , Silvia Ruth GORMAN , Scott P. CAMPBELL , Paul J. BEAUMONT , John MARKO
IPC: C08F14/26 , H01B13/14 , H01B11/18 , H01B7/02 , H01B3/44 , H01B3/30 , C08J5/18 , B29C47/00 , B29C47/54 , B29K27/18
CPC classification number: C08F14/26 , B29C48/0011 , B29C48/022 , B29C48/06 , B29C48/08 , B29C48/475 , B29K2027/18 , C08J5/18 , C08J2327/18 , H01B3/30 , H01B3/445 , H01B7/0241 , H01B11/18 , H01B13/148 , Y10T428/24479
Abstract: The present disclosure relates to methods of making an article comprising PTFE, methods of making expanded articles comprising PTFE, articles comprising PTFE, and expanded articles comprising PTFE having improved mechanical and electrical performance and particularly reduced variability in mechanical, electrical and dimensional properties, particularly over long lengths.
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公开(公告)号：US20230111961A1
公开(公告)日：2023-04-13
申请号：US18063355
申请日：2022-12-08
Inventor： Jennifer ADAMCHUK , Dale THOMAS , Meghann WHITE , Sethumadhavan RAVICHANDRAN , Gerard T. BUSS
IPC: C09J7/24 , C09J11/04 , B32B15/20 , C09J7/38 , H05K1/09 , B32B7/12 , B32B15/08 , B32B27/20 , B32B27/28 , H05K1/03
Abstract: The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 microns and not greater than about 1.7, a D50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D90 of at least about 2.7 microns and not greater than about 6 microns.
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