公开(公告)号：US20220033617A1

公开(公告)日：2022-02-03

申请号：US17443385

申请日：2021-07-26

Applicant: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION

Inventor： Jennifer ADAMCHUK ,  Gerard T. Buss ,  Theresa M. Besozzi

IPC: C08K3/36 ,  C08K3/22 ,  H05K1/05 ,  B32B15/20 ,  B32B15/085 ,  B32B27/20 ,  B32B27/32

Abstract: The present disclosure relates to a dielectric substrate that may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 microns and not greater than about 1.7, a D50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D90 of at least about 2.7 microns and not greater than about 6 microns.

公开(公告)号：US11596064B2

公开(公告)日：2023-02-28

申请号：US17443390

申请日：2021-07-26

Applicant: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION

Inventor： Jennifer Adamchuk ,  Gerard T. Buss ,  Theresa M. Besozzi

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/05

Abstract: The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

公开(公告)号：US20230164914A1

公开(公告)日：2023-05-25

申请号：US18157918

申请日：2023-01-23

Applicant: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION

Inventor： Jennifer ADAMCHUK ,  Gerard T. Buss ,  Theresa M. Besozzi

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/05

CPC classification number: H05K1/0373 ,  H05K1/09 ,  H05K1/05 ,  H05K2201/0358

Abstract: The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

公开(公告)号：US11805600B2

公开(公告)日：2023-10-31

申请号：US18157918

申请日：2023-01-23

Applicant: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION

Inventor： Jennifer Adamchuk ,  Gerard T. Buss ,  Theresa M. Besozzi

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/05

CPC classification number: H05K1/0373 ,  H05K1/05 ,  H05K1/09 ,  H05K2201/0358

Abstract: The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

公开(公告)号：US20220039256A1

公开(公告)日：2022-02-03

申请号：US17443386

申请日：2021-07-26

Applicant: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION

Inventor： Jennifer ADAMCHUK ,  Gerard T. Buss ,  Theresa M. Besozzi

IPC: H05K1/05 ,  H05K3/44 ,  C09D5/24 ,  C09D127/12

Abstract: The present disclosure relates to a copper-clad laminate that may include a copper foil layer and a dielectric coating overlying the copper foil layer. The dielectric coating may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The dielectric coating may have an average thickness of not greater than about 20 microns.