- 专利标题: METHOD OF FORMING A SEMICONDUCTOR DEVICE, AND A PHOTOMASK USED THEREIN
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申请号: US17001301申请日: 2020-08-24
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公开(公告)号: US20220059346A1公开(公告)日: 2022-02-24
- 发明人: Hidenori Yamaguchi , Keizo Kawakita , Wataru Hoshino , Shigeru Sugioka , Toshiyuki Maenosono
- 申请人: MICRON TECHNOLOGY, INC.
- 申请人地址: US ID BOISE
- 专利权人: MICRON TECHNOLOGY, INC.
- 当前专利权人: MICRON TECHNOLOGY, INC.
- 当前专利权人地址: US ID BOISE
- 主分类号: H01L21/027
- IPC分类号: H01L21/027 ; H01L21/311 ; H01L27/108
摘要:
A method including forming an insulating film over first, second, third and fourth regions of a semiconductor substrate; forming a polyimide film on the insulating film; and patterning the polyimide film with a lithography method using a photomask including at least a first region of a first transmittance rate, a second region of a second transmittance rate, a third region. having a shading material, and a fourth region, wherein the first, second, third and fourth regions of the photomask correspond to the first, second, third and fourth regions of the semiconductor substrate, respectively.
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