- 专利标题: HYPERELASTIC BINDER FOR PRINTED, STRETCHABLE ELECTRONICS
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申请号: US17500931申请日: 2021-10-13
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公开(公告)号: US20220071003A1公开(公告)日: 2022-03-03
- 发明人: Joseph WANG , Rajan Kumar , Ying Shirley Meng , Jae Wook Shin , Lu Yin
- 申请人: The Regents of the University of California
- 申请人地址: US CA Oakland
- 专利权人: The Regents of the University of California
- 当前专利权人: The Regents of the University of California
- 当前专利权人地址: US CA Oakland
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; C08F297/04 ; C08L53/02 ; H01M4/38 ; H01M4/48 ; H01M4/62 ; H01M4/66 ; H01M10/24 ; H05K1/03 ; H05K1/11 ; H05K1/16 ; H05K3/32 ; A61B5/1477
摘要:
Disclosed are compositions, devices, systems and fabrication methods for stretchable composite materials and stretchable electronics devices. In some aspects, an elastic composite material for a stretchable electronics device includes a first material having a particular electrical, mechanical or optical property; and a multi-block copolymer configured to form a hyperelastic binder that creates contact between the first material and the multi-block copolymer, in which the elastic composite material is structured to stretch at least 500% in at least one direction of the material and to exhibit the particular electrical, mechanical or optical property imparted from the first material. In some aspects, the stretchable electronics device includes a stretchable battery, biofuel cell, sensor, supercapacitor or other device able to be mounted to skin, clothing or other surface of a user or object.
公开/授权文献
- US11678436B2 Hyperelastic binder for printed, stretchable electronics 公开/授权日:2023-06-13
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