Invention Application
- Patent Title: SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
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Application No.: US17537317Application Date: 2021-11-29
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Publication No.: US20220084958A1Publication Date: 2022-03-17
- Inventor: Peng YANG , Yuan-Feng CHIANG , Po-Wei LU
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31 ; H01L23/538 ; H01L21/48 ; H01L21/56 ; H01L23/16
Abstract:
A semiconductor device package comprises a semiconductor device, a first encapsulant surrounding the semiconductor device, a second encapsulant covering the semiconductor device and the first encapsulant, and a redistribution layer extending through the second encapsulant and electrically connected to the semiconductor device.
Public/Granted literature
- US11837557B2 Semiconductor device package and a method of manufacturing the same Public/Granted day:2023-12-05
Information query
IPC分类:
