Invention Application
- Patent Title: POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES
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Application No.: US17540141Application Date: 2021-12-01
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Publication No.: US20220093516A1Publication Date: 2022-03-24
- Inventor: Kemal AYGUN , Zhiguo QIAN , Jianyong XIE
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L21/48 ; H01L23/48 ; H01L23/498 ; H01L23/31

Abstract:
Methods/structures of joining package structures are described. Those methods/structures may include a die disposed on a surface of a substrate, an interconnect bridge embedded in the substrate, and at least one vertical interconnect structure disposed through a portion of the interconnect bridge, wherein the at least one vertical interconnect structure is electrically and physically coupled to the die.
Public/Granted literature
- US11621227B2 Power delivery for embedded bridge die utilizing trench structures Public/Granted day:2023-04-04
Information query
IPC分类: