Invention Application
- Patent Title: INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME
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Application No.: US17545072Application Date: 2021-12-08
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Publication No.: US20220093786A1Publication Date: 2022-03-24
- Inventor: SEUNGMIN SONG , JUNBEOM PARK , BONGSEOK SUH , JUNGGIL YANG
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2019-0062057 20190527
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L29/423 ; H01L21/8234 ; H01L27/088

Abstract:
Integrated circuit devices including a fin shaped active region and methods of forming the same are provided. The devices may include a fin shaped active region, a plurality of semiconductor patterns on the fin shaped active region, a gate electrode on the plurality of semiconductor patterns, and source/drain regions on opposing sides of the gate electrode, respectively. The gate electrode may include a main gate portion extending on an uppermost semiconductor pattern and a sub-gate portion extending between two adjacent ones of the plurality of semiconductor patterns. The sub-gate portion may include a sub-gate center portion and sub-gate edge portions. In a horizontal cross-sectional view, a first width of the sub-gate center portion in a first direction may be less than a second width of one of the sub-gate edge portions in the first direction.
Public/Granted literature
- US11699759B2 Integrated circuit devices and methods of manufacturing the same Public/Granted day:2023-07-11
Information query
IPC分类: