Invention Application
- Patent Title: MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER
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Application No.: US17555222Application Date: 2021-12-17
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Publication No.: US20220108957A1Publication Date: 2022-04-07
- Inventor: Robert Alan MAY , Islam A. SALAMA , Sri Ranga Sai BOYAPATI , Sheng LI , Kristof DARMAWIKARTA , Robert L. SANKMAN , Amruthavalli Pallavi ALUR
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L21/56 ; H01L21/683 ; H01L23/31 ; H01L23/00 ; H01L25/065
Abstract:
A microelectronic device is formed to include an embedded die substrate on an interposer; where the embedded die substrate is formed with no more than a single layer of transverse routing traces. In the device, all additional routing may be allocated to the interposer to which the embedded die substrate is attached. The embedded die substrate may be formed with a planarized dielectric formed over an initial metallization layer supporting the embedded die.
Public/Granted literature
- US12046560B2 Microelectronic device with embedded die substrate on interposer Public/Granted day:2024-07-23
Information query
IPC分类:
