A processor package module comprises a processor-memory stack including one or more compute die stacked and interconnected with a memory stack on a substrate. One or more photonic die is on the substrate to transmit and receive optical I/O, the one or more photonic die connected to the processor-memory stack and connected to external components through a fiber array. The substrate is mounted into a socket housing, such as a land grid array (LGA) socket. An array of processor package modules are interconnected on a processor substrate via fiber arrays and optical connectors to form a processor chip complex.