Invention Application
- Patent Title: LOW-DISPERSION COMPONENT IN AN ELECTRONIC CHIP
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Application No.: US17566437Application Date: 2021-12-30
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Publication No.: US20220122910A1Publication Date: 2022-04-21
- Inventor: François TAILLIET , Guilhem BOUTON
- Applicant: STMICROELECTRONICS (ROUSSET) SAS
- Applicant Address: FR Rousset
- Assignee: STMICROELECTRONICS (ROUSSET) SAS
- Current Assignee: STMICROELECTRONICS (ROUSSET) SAS
- Current Assignee Address: FR Rousset
- Priority: FR1656020 20160628
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L21/66 ; H01L21/768 ; H01L23/528 ; H01L27/02 ; H01L49/02
Abstract:
A method of manufacturing electronic chips containing low-dispersion components, including the steps of: mapping the average dispersion of said components according to their position in test semiconductor wafers; associating, with each component of each chip, auxiliary correction elements; activating by masking the connection of the correction elements to each component according to the initial mapping.
Public/Granted literature
- US12087683B2 Low-dispersion component in an electronic chip Public/Granted day:2024-09-10
Information query
IPC分类:
