Invention Application
- Patent Title: BULK ACOUSTIC WAVE RESONATOR
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Application No.: US17232828Application Date: 2021-04-16
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Publication No.: US20220123714A1Publication Date: 2022-04-21
- Inventor: Dae Hun JEONG , Jeong Hoon RYOU , Jong Woon KIM
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-0134449 20201016
- Main IPC: H03H9/08
- IPC: H03H9/08 ; H03H9/17

Abstract:
A bulk acoustic wave resonator includes: a substrate; a resonant portion including a sequentially stacked first electrode, piezoelectric layer, and second electrode; a cavity defined between the substrate and the resonant portion; and a heat dissipation portion disposed in the cavity and supporting the resonant portion. The second electrode includes a first region and a second region having a thickness greater than a thickness of the first region, and the second region is disposed above the heat dissipation portion.
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