Invention Application
- Patent Title: Depositing Low Roughness Diamond Films
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Application No.: US17078474Application Date: 2020-10-23
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Publication No.: US20220127721A1Publication Date: 2022-04-28
- Inventor: Vicknesh Sahmuganathan , Zhongxin Chen , Gu Jiteng , Eswaranand Venkatasubramanian , Loh Kian Ping , Abhijit Basu Mallick , John Sudijono
- Applicant: Applied Materials, Inc. , National University of Singapore
- Applicant Address: US CA Santa Clara; SG Singapore
- Assignee: Applied Materials, Inc.,National University of Singapore
- Current Assignee: Applied Materials, Inc.,National University of Singapore
- Current Assignee Address: US CA Santa Clara; SG Singapore
- Main IPC: C23C16/27
- IPC: C23C16/27 ; H01L21/02 ; C23C16/54 ; C23C16/455 ; C23C16/511
Abstract:
Methods of depositing a diamond layer are described, which may be used in the manufacture of integrated circuits. Methods include processing a substrate in which nanocrystalline diamond deposited on a substrate, wherein the processing methods result in a nanocrystalline diamond hard mask having high hardness.
Information query
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