Invention Application
- Patent Title: MEMORY SUB-SYSTEM TEMPERATURE CONTROL
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Application No.: US17085671Application Date: 2020-10-30
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Publication No.: US20220138073A1Publication Date: 2022-05-05
- Inventor: Ting Luo , Tao Liu , Christopher J. Bueb , Eric Yuen , Cheng Cheng Ang
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Main IPC: G06F11/30
- IPC: G06F11/30 ; G06F11/07

Abstract:
A method includes monitoring a temperature of a memory component of a memory sub-system to determine that the temperature of the memory component corresponds to a first monitored temperature value; writing data to the memory component of the memory sub-system while the temperature of the memory component corresponds to the first monitored temperature value; determining that the first monitored temperature value exceeds a threshold temperature range; monitoring the temperature of the memory component of the memory sub-system to determine that the temperature of the memory component corresponds to a second monitored temperature value that is within the threshold temperature range; and rewriting the data to the memory component of the memory sub-system while the temperature of the memory component corresponds to the second monitored temperature value.
Public/Granted literature
- US11442833B2 Memory sub-system temperature control Public/Granted day:2022-09-13
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