Invention Application
- Patent Title: CHUCK FOR PLASMA PROCESSING CHAMBER
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Application No.: US17435340Application Date: 2020-03-04
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Publication No.: US20220139681A1Publication Date: 2022-05-05
- Inventor: Ann ERICKSON , Darrell EHRLICH
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- International Application: PCT/US2020/021003 WO 20200304
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/683
Abstract:
An electrostatic chuck system for a plasma processing chamber is provided. A base plate comprising Al—SiC is provided. A ceramic plate is disposed over the base plate. A bonding layer bonds the ceramic plate to the base plate.
Public/Granted literature
- US12131890B2 Chuck for plasma processing chamber Public/Granted day:2024-10-29
Information query
